Hideo Miura,: search on Z-Library

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1

SAE Technical Paper Series [SAE International SAE 2002 World Congress & Exhibition - (MAR. 04, 2002)] SAE Technical Paper Series - Automatic Transmission Control System Developed for Toyota Mild Hybrid System (THS-M)

Tomomatsu, Hideo, Tanaka, Yoshikazu, Nakatani, Katsumi, Tomohiro, Tadasu, Matsubara, Tooru, Miyachi, Eiji, Miura, Kiyotomo

Year:

2002

Language:

english

File:

PDF, 210 KB

english, 2002

2

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Kato, Takeru, Suzuki, Ken, Miura, Hideo

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.83 MB

english, 2017

3

[ASME ASME 2017 International Mechanical Engineering Congress and Exposition - Tampa, Florida, USA (Friday 3 November 2017)] Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Structural Health Monitoring and Prognosis - Stress-Induced Change of the Microstructure and Strength of Modified 9Cr-1Mo Steel Under Fatigue and Creep Loadings at Elevated Temperatures

Shinozaki, Taichi, Suzuki, Ken, Miura, Hideo

Year:

2017

Language:

english

File:

PDF, 2.12 MB

english, 2017

4

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Miura, Hideo, Kitano, Makoto, Nishimura, Asao, Kawai, Sueo

Journal:

Journal of Electronic Packaging

Year:

1993

Language:

english

File:

PDF, 693 KB

english, 1993

5

Development of a Visualization Method for Motion-characteristic Distribution of Japanese Folk Dances - A Case Study of the Bon Odori Dance

Miura, Takeshi, Kaiga, Takaaki, Shibata, Takeshi, Uemura, Madoka, Tajima, Katsubumi, Tamamoto, Hideo

Journal:

Journal of Information Processing

Year:

2018

Language:

english

File:

PDF, 2.41 MB

english, 2018

6

Stress-Development Mechanism during Cobalt-Silicide Film Formation.

SHIMAZU, Hiromi, MIURA, Hideo

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2000

File:

PDF, 781 KB

2000

7

Protonation of Histidine and Histidine−Tryptophan Interaction in the Activation of the M2 Ion Channel from Influenza A Virus †

Okada, Atsushi, Miura, Takashi, Takeuchi, Hideo

Journal:

Year:

2001

Language:

english

File:

PDF, 167 KB

english, 2001

8

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Study of Submicron Patterning Exposure Tool for Fine 500 mm Panel Size FOPLP

MORI, Ken-Ichiro, SHELTON, Douglas, GOTO, Yoshio, SUDA, Hiromi, WADA, Hiroyuki, TANAKA, Hideo, MIURA, Seiya

Year:

2020

File:

PDF, 834 KB

2020

9

[ASME ASME Turbo Expo 2015: Turbine Technical Conference and Exposition - Montreal, Quebec, Canada (Monday 15 June 2015)] Volume 9: Oil and Gas Applications; Supercritical CO2 Power Cycles; Wind Energy - Verification of Performance and Operating Characteristics of High Pressure Gas Injection Centrifugal Compressor

Yanagihara, Kazutoshi, Miura, Haruo, Nishida, Hideo, Tanaka, Kenji, Takahashi, Naohiko, Yagi, Manabu, Naruse, Tomohiro, Ridens, Brandon L.

Year:

2015

Language:

english

File:

PDF, 1.26 MB

english, 2015

10

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Tanaka, Naotaka, Kawano, Kenya, Miura, Hideo, Kado, Yoshiyuki, Yoshida, Ikuo

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 860 KB

english, 2004

11

[IEEE 2015 IEEE International Memory Workshop (IMW) - Monterey, CA, USA (2015.5.17-2015.5.20)] 2015 IEEE International Memory Workshop (IMW) - 1T1MTJ STT-MRAM Cell Array Design with an Adaptive Reference Voltage Generator for Improving Device Variation Tolerance

Koike, Hiroki, Miura, Sadahiko, Honjo, Hiroaki, Watanabe, Tosinari, Sato, Hideo, Sato, Soshi, Nasuno, Takashi, Noguchi, Yasuo, Yasuhira, Mitsuo, Tanigawa, Takaho, Muraguchi, Masakazu, Niwa, Masaaki, I

Year:

2015

Language:

english

File:

PDF, 345 KB

english, 2015

12

The effects of ball milling on microstructures of graphene/Ni composites and their catalytic activity for hydrogen evolution reaction

Jinlong, Lv, Wang, Zhuqing, Miura, Hideo

Journal:

Materials Letters

Year:

2017

Language:

english

File:

PDF, 493 KB

english, 2017

13

Fabrication of a Nonvolatile Full Adder Based on Logic-in-Memory Architecture Using Magnetic Tunnel Junctions

Matsunaga, Shoun, Hayakawa, Jun, Ikeda, Shoji, Miura, Katsuya, Hasegawa, Haruhiro, Endoh, Tetsuo, Ohno, Hideo, Hanyu, Takahiro

Journal:

Applied Physics Express

Year:

2008

Language:

english

File:

PDF, 529 KB

english, 2008

14

Microstructure of surface area and etching behavior of high-purity aluminum foils for electrolytic capacitors

KAWAI, Masahiko, YAMADA, Kazuhiro, UMEZAKI, Tomonori, KONISHI, Akira, WATANABE, Hideo, MIURA, Yasuhiro

Journal:

Journal of Japan Institute of Light Metals

Year:

2004

Language:

english

File:

PDF, 3.45 MB

english, 2004

15

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices

Mizuno, Ryota, Suzuki, Ken, Miura, Hideo

Year:

2017

Language:

english

File:

PDF, 1.16 MB

english, 2017

16

OS0604 Influence of trace additive element on stress induced anisotropic atomic diffusion in Ni-base superalloy

SUZUKI, Ken, ITO, Hiroyuki, INOUE, Tatsuya, MIURA, Hideo

Journal:

The Proceedings of the Materials and Mechanics Conference

Year:

2008

File:

PDF, 459 KB

2008

17

Posttraumatic Spinal Stenosis of the Lumbar Spine

HASUE, MITSUO, KIKUCHI, SHINICHI, INOUE, KAZUO, MIURA, HIDEO

Journal:

Year:

1980

File:

PDF, 435 KB

1980

18

Shape Control of Shallow-Groove-Isolation Structure for Semiconductor Devices by Stress Reduction.

ISHITSUKA, Norio, MIURA, Hideo, SAITO, Naoto, YOSHIDA, Yasuko, SUZUKI, Norio, IKEDA, Syuji

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2000

File:

PDF, 810 KB

2000

19

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Murata, Naokazu, Tamakawa, Kinji, Suzuki, Ken, Miura, Hideo

Year:

2009

Language:

english

File:

PDF, 3.32 MB

english, 2009

20

Strength Evaluation Technique for Dislocation Generation in Si Substrate using Ball Indenter.

OHTA, Hiroyuki, MIURA, Hideo, KITANO, Makoto

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

1997

File:

PDF, 897 KB

1997

21

Stress Analysis of Transistor Structures Considering Internal Stress of Thin Films.

Miura, Hideo, Ishitsuka, Norio, Saito, Naoto, Ohta, Hiroyuki, Hashimoto, Chiemi, Ikeda, Shuji

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

1994

File:

PDF, 778 KB

1994

22

Synthesis and photochemical reaction of diels-alder adduct of phosphole oxide and cyclopentadiene

Hideo Tomioka, Shinichi Miura, Yasuji Izawa

Journal:

Tetrahedron Letters

Year:

1983

Language:

english

File:

PDF, 212 KB

english, 1983

23

Correlation of plasma prolactin and growth hormone with normal and preneoplastic mammary gland growth in virgin SHN mice

Nagasawa, Hiroshi, Nozaki, Daisuke, Miura, Kumiko, Niki, Kaoru, Namiki, Hideo

Journal:

European Journal of Cancer and Clinical Oncology

Year:

1985

Language:

english

File:

PDF, 247 KB

english, 1985

24

Superdense microbands strengthening of textured low alloy ferritic steel

Cheng, Lei, Cai, Qingwu, Lv, Jinlong, Yu, Wei, Miura, Hideo

Journal:

Journal of Alloys and Compounds

Year:

2018

Language:

english

File:

PDF, 1.59 MB

english, 2018

25

Parallel-plate submicron gap formed by micromachined low-density pillars for near-field radiative heat transfer

Ito, Kota, Miura, Atsushi, Iizuka, Hideo, Toshiyoshi, Hiroshi

Journal:

Applied Physics Letters

Year:

2015

Language:

english

File:

PDF, 922 KB

english, 2015

26

Development of CAE System for Structural Design of LSI Packages

KOJIMA, Kiyomi, TERASAKI, Takeshi, MIURA, Hideo, NISHIMURA, Asao

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2003

File:

PDF, 792 KB

2003

27

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Gotoh, Masaru, Suzuki, Ken, Miura, Hideo

Year:

2015

Language:

english

File:

PDF, 4.92 MB

english, 2015

28

[ASME ASME 2017 International Mechanical Engineering Congress and Exposition - Tampa, Florida, USA (Friday 3 November 2017)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation

Isobe, Koki, Suzuki, Ken, Miura, Hideo

Year:

2017

Language:

english

File:

PDF, 1.90 MB

english, 2017

29

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films

Furuya, Ryosuke, Fan, Chuanhong, Asai, Osamu, Suzuki, Ken, Miura, Hideo

Year:

2013

Language:

english

File:

PDF, 2.45 MB

english, 2013

30

Development of Evaluation Method for Estimating Stress-Induced Change in Drain Current in Deep-sub-micron MOSFETs

KUMAGAI, Yukihiro, OHTA, Hiroyuki, MIURA, Hideo, SHIMIZU, Akihiro, KAMOHARA, Shiro, MAEKAWA, Keiichi

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2006

File:

PDF, 1.32 MB

2006

31

Detection of Recombinant DNA Segments Introduced to Genetically Modified Maize ( Zea mays )

Matsuoka, Takeshi, Kuribara, Hideo, Takubo, Ken, Akiyama, Hiroshi, Miura, Hirohito, Goda, Yukihiro, Kusakabe, Yuko, Isshiki, Kenji, Toyoda, Masatake, Hino, Akihiro

Journal:

Journal of Agricultural and Food Chemistry

Year:

2002

Language:

english

File:

PDF, 338 KB

english, 2002

32

Crystallization-induced stress in silicon thin films

Miura, Hideo, Ohta, Hiroyuki, Okamoto, Noriaki, Kaga, Toru

Journal:

Applied Physics Letters

Year:

1992

Language:

english

File:

PDF, 637 KB

english, 1992

33

Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu, Murata, Tamakawa, Kinji, Suzuki, Ken, Miura, Hideo

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 1.72 MB

english, 2010

34

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Ueta, Nobuki, Miura, Hideo

Year:

2005

Language:

english

File:

PDF, 646 KB

english, 2005

35

[ASME ASME 2015 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 13 November 2015)] Volume 9: Mechanics of Solids, Structures and Fluids - Elucidation of the High Cycle Fatigue Damage Mechanism of Modified 9Cr-1Mo Steel at Elevated Temperature

Murakoshi, Takuya, Ochi, Motoyuki, Suzuki, Ken, Miura, Hideo

Year:

2015

Language:

english

File:

PDF, 2.70 MB

english, 2015

36

Effects of Carbon and Nitrogen on the Tensile Deformation Behavior of SUS304 and 316 Stainless Steels at Cryogenic Temperatures

MIURA, Ritsu, OHNISHI, Keizo, NAKAJIMA, Hideo, SHIMAMOTO, Susumu

Journal:

Tetsu-to-Hagane

Year:

1987

Language:

english

File:

PDF, 1.21 MB

english, 1987

37

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections

Suzuki, Ken, Mizuno, Ryota, Nakoshi, Yutaro, Miura, Hideo

Year:

2019

File:

PDF, 3.24 MB

2019

38

Primary bone carcinosarcoma: Chondrosarcoma and squamous cell carcinoma with keratin pearl formation

Junichi Shiraishi, Makio Mukai, Hiroo Yabe, Rie Shibata, Taketo Yamada, Keiko Miura, Ukei Anazawa, Hideo Morioka, Michiie Sakamoto

Journal:

Pathology International

Year:

2005

Language:

english

File:

PDF, 252 KB

english, 2005

39

Development of Load Multipliers (Z-Factors) in Elastic-Plastic Fracture Mechanics Evaluation in the JSME Rules on Fitness-for-Service for Nuclear Power Plants

ASADA, Seiji, ITATANI, Masao, MIURA, Naoki, MACHIDA, Hideo

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2011

Language:

english

File:

PDF, 606 KB

english, 2011

40

Magnetophonon Resonance in a Two-Dimensional Electron System in the GaAs–Al x Ga 1- x As Heterojunction Interface

Kido, Giyuu, Miura, Noboru, Ohno, Hideo, Sakaki, Hiroyuki

Journal:

Journal of the Physical Society of Japan

Year:

1982

File:

PDF, 784 KB

1982

41

A 600-µW ultra-low-power associative processor for image pattern recognition employing magnetic tunnel junction-based nonvolatile memories with autonomic intelligent power-gating scheme

Ma, Yitao, Miura, Sadahiko, Honjo, Hiroaki, Ikeda, Shoji, Hanyu, Takahiro, Ohno, Hideo, Endoh, Tetsuo

Journal:

Japanese Journal of Applied Physics

Year:

2016

Language:

english

File:

PDF, 2.37 MB

english, 2016

42

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Nakanishi, Takahiro, Suzuki, Ken, Miura, Hideo

Year:

2015

Language:

english

File:

PDF, 6.44 MB

english, 2015

43

Evaluation of Strain-Rate-Dependent Fatigue-crack Propagation in 60 Sn/40 Pb Solder.

TERASAKI, Takeshi, KITANO, Makoto, MIURA, Hideo

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2000

File:

PDF, 673 KB

2000

44

Strain-Induced Change of Electronic Conductivity of Carbon Nanotubes

SUZUKI, Yusuke, OHNISHI, Masato, SUZUKI, Ken, MIURA, Hideo

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

2011

File:

PDF, 1.35 MB

2011

45

Residual Stress in the Silicon Substrate with Shallow Trenches on the Surface after Local Thermal Oxidation.

Miura, Hideo, Saito, Naoto, Ohta, Hiroyuki, Okamoto, Noriaki

Journal:

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

Year:

1993

File:

PDF, 808 KB

1993

46

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Murata, Naokazu, Saito, Naoki, Tamakawa, Kinji, Suzuki, Ken, Miura, Hideo

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 5.23 MB

english, 2015

47

Evaluation of Camera-Trap Designs for Photographing Chest Marks of the Free-Ranging Asiatic Black Bear, Ursus thibetanus

Higashide, Daishi, Miura, Shingo, Miguchi, Hideo

Journal:

Year:

2013

Language:

english

File:

PDF, 307 KB

english, 2013

48

Ultrahighly Sensitive in Situ Metabolomic Imaging for Visualizing Spatiotemporal Metabolic Behaviors

Miura, Daisuke, Fujimura, Yoshinori, Yamato, Mayumi, Hyodo, Fuminori, Utsumi, Hideo, Tachibana, Hirofumi, Wariishi, Hiroyuki

Journal:

Analytical Chemistry

Year:

2010

Language:

english

File:

PDF, 4.98 MB

english, 2010

49

Existence and uniqueness theorem on mild solutions to the Keller–Segel system coupled with the Navier–Stokes fluid

Kozono, Hideo, Miura, Masanari, Sugiyama, Yoshie

Journal:

Journal of Functional Analysis

Year:

2016

Language:

english

File:

PDF, 1022 KB

english, 2016

50

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Sato, Yuhki, Miura, Hideo

Year:

2005

Language:

english

File:

PDF, 804 KB

english, 2005

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